Various manufacturing methods tailored to applications such as size and environment! We provide optimal heat dissipation solutions.
We offer large, high-performance, and durable heat sinks as a heat dissipation solution for high-heat devices such as industrial IGBTs and communication base stations. We provide optimal heat dissipation solutions through various manufacturing methods tailored to the application, including size and environment. [Heat Sink Structures and Manufacturing Methods] ■ Aluminum Extrusion ■ Skyv Processing ■ Stacked Fins ■ Solder-Free, Press-Fit, Stacked Fins ■ IGBT Heat Sinks for Transportation Vehicles ■ Fin Shapes *For more details, please refer to the PDF materials or feel free to contact us.
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We offer a wide range of cooling products, from server and PC products to embedded systems and LEDs. For heat dissipation, please consult CM Industry.
![[Case Study] Aluminum Extrusion Heat Sink](https://image.mono.ipros.com/public/product/image/224/2000355542/IPROS32877600373320369243.jpeg?w=280&h=280)
![[Information] Proposal for Reducing Component Costs (Available for Free Download Now!)](https://image.mono.ipros.com/public/product/image/4bb/2000647324/IPROS21667951438435143077.png?w=280&h=280)
