When both miniaturization and high thermal diffusion performance are required! Significantly better thermal performance than heat spreaders made of solid metal.
A "vapor chamber" is a mechanism that operates on principles similar to heat pipes, which dissipate thermal load and liquefy when in contact with a cold surface. It has far superior thermal performance compared to conventional solid metal heat spreaders, making it suitable for applications where miniaturization and high thermal diffusion performance are required. Like heat pipes, it is expected to see increasing demand for use in mobile devices due to its thin profile and as a base for heat sinks that leverage its excellent thermal diffusion properties. 【Vapor Chamber Structure】 ■ Top Cover ■ Mesh/Wick ■ Copper Sintered Support ■ Mesh/Wick ■ Bottom Cover ■ Liquid Inlet *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Advanced Vapor Chamber (3D Vapor Chamber) Features】 ■ Used to transfer high heat generation ■ By combining heat pipes and vapor chambers, high heat transfer and space-saving through design flexibility are achieved ■ The 3D Vapor Chamber (Advanced Vapor Chamber) cancels out the unavoidable thermal resistance of conventional combinations, achieving superior heat transfer and establishing a system with high cooling capability * For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
We offer a wide range of cooling products, from server and PC products to embedded systems and LEDs. For heat dissipation, please consult CM Industry.