Non-electrolytic gold plating - Development and mass production examples (plating technology)
Can be uniformly deposited on substrates with fine independent patterns! For multi-pin connectors and semiconductor ceramic substrates!
To ensure the conductivity of finely patterned substrates and connectors, gold (Au) plating is often required. In such cases, electroplating is commonly used, but there are instances where electroplating cannot be applied. "For the sake of the substrate pattern, it is not possible to ensure conductivity for plating." "The shape is complex, leading to variations in film thickness with electroplating." "Plating is desired on the terminal parts while in a resin-molded state." In such cases, electroless gold (Au) plating can be utilized. In particular, our company can deposit gold plating with almost uniform film thickness on finely patterned substrates, even on independent patterns. This means that the issues associated with traditional electroplating, such as ensuring contact, occurrence of non-deposition, and variations in film thickness, can be resolved with our electroless gold plating. The base plating is electroless nickel (Ni-p), and it is also possible to add an electroless palladium (Pd) intermediate layer, with proven results in mass production. Currently, we are engaged in technological development aimed at further enhancing functionality and performance. We can also accommodate prototype and sample creation. Please feel free to consult with us.
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basic information
【Mass-producible plating specifications】 ■ Base plating: Electroless nickel plating (thickness range: 0.5–10μ+α) ■ Intermediate plating: Electroless palladium plating (prevents diffusion of the underlying Ni layer due to heat) The presence of palladium can be set optionally. ■ Finish plating: Electroless gold plating (good WB properties and solder joint compatibility) * This plating film is suitable for weak electrical components such as semiconductors. * The thickness of the plating can be adjusted as desired. * Electroless nickel (Ni-p) and electroless palladium (Pd) finishes are also available. 【Features of Yuden-sha's electroless gold (Au) plating】 ■ No contact marks (unplated areas) on the components. ■ Minimal variation in the thickness of the plating film. ■ Can achieve almost uniform plating deposition even on fine patterning where plating is difficult to deposit. ■ Stable plating quality. ■ No dummy required for ensuring current flow needed in electroplating (cost reduction). The materials suitable for plating can accommodate a wide range. Examples: Aluminum, stainless steel, iron, copper, alloys, difficult materials (molybdenum, tungsten), etc. * For more details, please refer to the PDF document or feel free to contact us.
Price information
It varies depending on the content and quantity. Please contact us.
Delivery Time
※It varies depending on the content and quantity. Please contact us.
Applications/Examples of results
We have a track record in ceramic substrates for semiconductors, multi-pin glass hermetic products (stems), and intricate fine connectors with complex shapes.
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Company information
The slogan is "Challenge the Impossible." We are a technology development-oriented company that broadly develops unique surface treatment technologies to meet the special needs required for essential low-voltage components (related to electricity, electronics, and semiconductors), high-voltage components (such as high-voltage connectors), and insulating components. Additionally, we have established a support system that incorporates functional surface treatments, which we have cultivated since our founding, as our core technology, along with processes such as pressing, heat treatment, painting, and assembly. We will continue to deliver consistent Yuden-sha brand technologies and products to the world. *We support online business meetings.