Our "water-soluble phenolic resin" enables hydrophilization of the film surface by utilizing its high adhesion to polyamides, polyesters, and cellulose.
Our water-soluble phenolic resin demonstrates high robustness due to the hydrogen bonding strength between the hydroxyl groups of DHDPS and the carbonyl and amino groups of the aromatic polyamide film, in addition to the crosslinking utilizing the methylol groups at the ends of the resol-type water-soluble phenolic resin. After chlorination of the aromatic polyamide film, surface treatment with water-soluble phenolic resin allows the resin to adhere to the film, improving the blocking rate of hardness components in water. *Please feel free to download the catalog or contact us for more information.*
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basic information
Water-soluble phenolic resin - Resole resin of dihydroxydiphenylsulfone (DHDPS) and phenolsulfonic acid - Solid content concentration: 30% - pH: 9-10 *Please feel free to download the catalog or contact us for more information.*
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【Hydrophilization Treatment of Membranes - An Example】 ■ Preparation of Treatment Solution ・ Water-soluble phenolic resin WSR-SP82 0.03 mg/L aqueous solution ・ pH: 4 (adjusted with acetic acid) ■ Treatment Conditions ・ Pressure: 0.35 MPa ・ Time: 1 hour *Please feel free to contact us or download the catalog.
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Company information
KONISHI Chemical Industry Co., Ltd. develops, manufactures, sells, and provides contract manufacturing of functional chemicals used in a wide range of applications, including information electronic materials, functional resins, special monomers, silicon-based organic/inorganic hybrid materials, and pharmaceutical intermediates. We strive to translate new technologies and customer needs into chemistry in our own way, challenging ourselves to design new functional materials.