Cleared the 1 million cycle pressure test under design pressure! Diffusion bonding of base material strength.
The "WEL-Cool Heat Exchanger CF0.5" is a customizable small microchannel heat exchanger with adjustable heat exchange capacity and design pressure. It features high heat exchange performance with φ0.5mm channels and has passed a pressure resistance test of one million cycles at the design pressure. Made entirely of SUS316L, it is lightweight and palm-sized, allowing for direct connection to piping. 【Features】 ■ High heat exchange performance with φ0.5mm channels ■ Lightweight and palm-sized for direct connection to piping ■ Made entirely of SUS316L, with diffusion bonding of base material strength ■ Passed a pressure resistance test of one million cycles at the design pressure ■ Customizable heat exchange capacity and design pressure *For more details, please refer to the PDF document or feel free to contact us.
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【Standard Product Specifications (Excerpt)】 ■Heat Exchange Type: Cross Flow ■Material (JIS): SUS316L ■Width (mm): 76 ■Depth (mm): 76 ■Height (mm): 29 ■Weight (g): 700 ■Heat Transfer Area (m²): 0.0231 *For more details, please refer to the PDF document or feel free to contact us.
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High-performance, compact, lightweight, and thermal management components provided through fine diffusion bonding technology, contributing to energy savings. Not just bonding, but also one-stop shopping for structural design, thermal fluid design, and more. We accommodate everything from prototype single items to mass production. Capable of fine three-dimensional structures, surface bonding, laminated bonding of thin plates, and bonding of dissimilar materials. Suitable for mass production of prototypes for 3D laminated structures and 3D printers. Applicable to hollow components, fine three-dimensional structures, high-pressure and high-efficiency heat exchangers with fine flow paths, high-efficiency heat sinks, reactors, mixers, and more. Extensive experience and proven results in providing solutions across various industries, including automotive, medical devices, semiconductor manufacturing equipment, food equipment, special inspection devices, power, and electrical/electronic components. For more details, please contact us.
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