Automatic resin coating device capable of temperature control for each stage.
The "SB0S-2000H" is a three-stage, two-head type automatic resin coating device. It was developed for resin encapsulation applications in COB (Chip On Board), but it can also be repurposed for various applications as it can draw two types of resin in free trajectories. Additionally, since it has an intermediate stage, it can be used for processes such as semi-curing to curing of the resin. (Currently, it only supports thermal curing; UV curing and other options are available upon consultation.) 【Features】 ■ Adjustable based on thermal curing properties and fluidity ■ The coating trajectory can pass through coordinates set in the program, allowing for irregular drawing ■ Height sensors enable inspection for exceeding upper and lower limits of height reference values *For more details, please download the PDF or feel free to contact us.
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【Specifications】 ■Work size X Length (flow direction): min 30mm - max 330mm ■Work size Y Width (depth): min 20mm - max 110mm *For more details, please download the PDF or feel free to contact us.
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Our company is walking together with Mitutoyo, a measuring instrument company that spreads its wings globally, and Seiko, a partner in electronic components and watches.