High energy efficiency with special waveforms! Welding of high multi-layer products is possible.
This device is a high-frequency pulse welding machine designed and manufactured for multilayer boards, aimed at improving the soldering speed of packets while simultaneously reducing energy costs, thereby facilitating the preparation of multilayer printed circuit boards. The operating principle of the system involves using a thermal introduction chip that acts with variable pressure according to the number of inner layers favorable for localized reactions of the prepreg, performing multiple soldering along both sides of the packet to bond the inner layers and the prepreg. Thanks to the synergy between the high-efficiency SHE (Smart Energy Head) and the "Smart Bonding" software, excellent results can be achieved in terms of reducing bonding time and saving energy. 【Features】 ■ Bonding speed improved up to 100% ■ Reduction of bonding area to maximize panel utilization ■ Elimination of special patterns in inner layers ■ Up to 80% high energy savings ■ Realization of intelligent computer control, etc. *For more details, please download the PDF or contact us.
Inquire About This Product
basic information
【Lineup】 ■SBM1000 ■MBM4100 *For more details, please download the PDF or contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or contact us.
catalog(1)
Download All CatalogsCompany information
Our company is engaged in the sale and import/export of printed circuit board manufacturing equipment and materials, as well as the sale of water treatment-related components. We fully support our customers' production through the supply of domestic and international printed circuit board manufacturing equipment, as well as assembly-related equipment and associated consumables. Please feel free to contact us if you have any inquiries.