In-house complete VIA plating line! Introduction of build-up multilayer printed circuit boards.
We would like to introduce the "Build-Up Multilayer Printed Circuit Boards" handled by our technology research institute. We offer a lineup of "1+4+1 Structure Build-Up Multilayer Printed Circuit Boards" that allows for pad on VIA, and "2+4+2 Structure Build-Up Multilayer Printed Circuit Boards" that can also accommodate stacked VIA specifications. Our company is equipped with an in-house VIA plating line, allowing us to handle even small quantities. 【Features of 1+4+1 Structure Build-Up Multilayer Printed Circuit Boards】 ■ Direct laser processing ■ VIA plating processing (without resin filling process) ■ Pad on VIA is also possible *For more details, please refer to the PDF document or feel free to contact us.
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【2+4+2 Structure Build-Up Multi-Layer Printed Circuit Board Features】 ■ Two-layer build-up structure ■ Stacked VIA specifications are also possible ■ Diverse variations ■ In-house artwork design is also available *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Chino Giken Co., Ltd. is a company primarily engaged in the design, manufacturing, and sales of printed circuit boards. To meet customer requirements, we optimize products through data processing (DRC and MRC) and provide reliable tools for the manufacturing process. Additionally, we offer advanced services such as development support for new products, pattern design, and circuit board assembly. We actively pursue new technologies to consistently capture customer needs and expectations, delivering high value-added products.