"Diffusion bonding" enables the production of high thermal conductivity and lightweight hollow aluminum components.
High thermal conductivity and lightweight hollow components made possible by aluminum diffusion bonding. Heat exchangers and cooling plates can be manufactured.
By using diffusion bonding of aluminum alloys, it is possible to manufacture lightweight hollow components with high thermal conductivity. We can accommodate a maximum size of 500×500. We will respond to customer requests from material procurement to processing. Please contact us for details about materials and specifications.
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Heat exchanger Cooling plate
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We are engaged in the production and development of mold components that incorporate heat exchange channels into various molds using metal solid joining (diffusion bonding) technology. We also provide support for product development and technical development using diffusion bonding.