It is possible to stack and join accurately, allowing for holes to be penetrated! Pressure loss can be controlled.
Our company has a high alignment accuracy that enables the precise realization of microchannel structures. Even when stacking 300 plates with a honeycomb hole structure ranging from 250μm to 800μm, it is possible to stack and bond them accurately, allowing for the holes to be continuous. We will consider an optimal internal structure design based on the specifications. Please feel free to contact us when needed. 【Microchannel Features】 ■ Contributes to reducing both diameter and flow path length ■ By controlling the convergence of both parameters, overall pressure loss can also be controlled ■ If the flow rate is constant, pressure loss can be controlled *For more details, please refer to the PDF document or feel free to contact us.
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High-performance, compact, lightweight, and thermal management components provided through fine diffusion bonding technology, contributing to energy savings. Not just bonding, but also one-stop shopping for structural design, thermal fluid design, and more. We accommodate everything from prototype single items to mass production. Capable of fine three-dimensional structures, surface bonding, laminated bonding of thin plates, and bonding of dissimilar materials. Suitable for mass production of prototypes for 3D laminated structures and 3D printers. Applicable to hollow components, fine three-dimensional structures, high-pressure and high-efficiency heat exchangers with fine flow paths, high-efficiency heat sinks, reactors, mixers, and more. Extensive experience and proven results in providing solutions across various industries, including automotive, medical devices, semiconductor manufacturing equipment, food equipment, special inspection devices, power, and electrical/electronic components. For more details, please contact us.