Adopting soft bonds and hard bonds! Enables sustained high-precision polishing.
The "DPG WHEEL" is a grinding wheel that utilizes a soft bond focused on sharpness and a hard bond that emphasizes surface roughness and wheel life over an extended period, enabling sustainable high-precision grinding for tools, semiconductor components, and precision grinding wheels. It is effective for processing non-ferrous metals, as well as carbide, cermet, ceramics, and copper. It can be used for applications such as processing magnetic materials, semiconductor components, and precision machining. 【Features】 ■ Utilizes soft bond and hard bond ■ Enables sustainable high-precision grinding ■ Effective for processing non-ferrous metals, carbide, cermet, ceramics, and copper ■ Standard dimensions: up to 16B *For more details, please refer to the PDF document or feel free to contact us.
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【Production Range】 ■Abrasive: SD ■Particle Size: #325 to #3,000 ■Hardness: L, M, N, O, P, Q, R *For more details, please refer to the PDF document or feel free to contact us.
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[Applications] ■ Magnetic materials, semiconductor component processing, etc. ■ Other precision machining applications *For more details, please refer to the PDF document or feel free to contact us.
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The technology of grinding and polishing is essential in all industrial fields and is indispensable for manufacturing. Moving forward, we at TKX will continue our daily technological innovations to meet a wide variety of needs, allowing each employee to demonstrate their capabilities. We will contribute to society through the products and goods we provide. Please feel free to contact us if you have any requests.