We perform special surface treatments with various characteristics!
We offer "Special Surface Treatment Services." By combining DFR technology and plating technology, we have various techniques such as "bump formation by plating," which allows for the formation of microbumps on patterned circuits, and "direct plating onto special films." 【Special Surface Treatment Technologies】 ■ Bump formation by plating ■ Direct plating onto special films ■ Manufacturing of hollow structures by plating 'HOSPLATE' *For more details, please download the PDF or feel free to contact us.
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【Technical Features】 <Formation of Bumps by Plating> ■ Bump Diameter: From 30 microns ■ Bump Height: 25 to 500 microns ■ Bump Materials: Cu, Ni, Ni-Co, Sn-Pb, Sn-Cu, etc. ■ Applications - Ultra-thin film connectors - Contacts for film probes - Bumps for micro BGA <Direct Plating on Special Films> ■ Metallization on the following special resin films enables the provision of high-performance FPCs - Plating on transparent PI *For medical device FPCs - Plating on PEEK material *For high-frequency applications (speakers, etc.) - Plating on PVDF material *For piezoelectric applications (sensors, speakers, etc.) - Plating on COP material *For high-frequency applications (5G antenna FPCs, etc.) - Plating on PAR material *For high heat resistance applications - Plating on PFA material *For high-frequency applications (5G antenna FPCs, etc.), etc. <Manufacturing of Hollow Structures by Plating 'HOSPLATE'> ■ V and C with a total thickness of less than 0.2mm is possible ■ V and C with an integrated wick structure can be provided *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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Since our establishment, we have specialized in the surface treatment of electronic communication device components, and in recent years, we have been a pioneer in plating processing for flexible substrates in Japan, making progress with the guidance and support of everyone. Additionally, we have newly established the "Advanced Technology Development Division" and are also challenging ourselves to develop various advanced technologies utilizing plating technology.