Wire cutting processing examples / Processing of semiconductor manufacturing equipment parts made of SUS304
Examples of processing manufacturing equipment parts! Introduction of cases involving processes such as wire cutting and ink filling!
We would like to introduce examples of processing for small-batch production of various semiconductor manufacturing equipment parts that our company has conducted. The "manufacturing equipment parts (small quantity)" are made of SUS304 material and have dimensions of 17mm × 40mm × 40mm. The processing features include machining centers, wire cutting, lapping (partially), and ink filling. At Inada Seisakusho, we consistently handle the entire process from part completion using techniques such as automatic lathe processing, lathe processing, machining center processing, and wire cutting. Please feel free to contact us when you need our services. 【Processing Examples】 ■ Manufacturing equipment parts (small quantity) ■ Material: SUS304 ■ Size: 17mm × 40mm × 40mm ■ Processing features: machining center, wire cutting, lapping (partially), ink filling *For more details, please refer to the PDF document or feel free to contact us.
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Inada Manufacturing Co., Ltd. is a company primarily engaged in the processing of labor-saving machine parts, mold parts, and mass-produced parts. We have equipment capable of handling a variety of machining processes, including lathes, automatic lathes, and machining centers. We accept precision parts cutting processing from single items to mass production according to our customers' requests. If you have any questions or inquiries regarding precision parts cutting processing, please feel free to contact us.