Signal analyzer/vector signal analysis equipment suitable for transmission and reception analysis of mobile communications such as LTE.
We offer the signal analyzer 'N9030A/89601A', which can measure signal frequency, power, harmonic components, modulation, spurious signals, and noise from 3Hz to 26.5GHz. With a dynamic range of up to 75dB without spurious signals and a 40MHz analysis bandwidth, detailed spectrum measurements of signals are possible. Additionally, the vector signal analyzer software allows for detailed analysis of WLAN signals and the collection of necessary data for troubleshooting physical layer signals. 【Features】 ■ The comprehensive toolset provided by the vector signal analyzer enables detailed analysis of 802.11a/b/g/n signals. ■ Measurements of total harmonic distortion, occupied bandwidth, signal stability, output power, intermodulation distortion, power bandwidth, and carrier-to-noise ratio are also possible. *For more details, please download the PDF or feel free to contact us.
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【Main Specifications】 ■N9030A PXA Signal Analyzer - Capable of measuring frequency range from 3Hz to 26.5GHz - Maximum 75dB dynamic range without spurious - Analysis bandwidth: 40MHz - 12 markers, marker table, simultaneous detectors, etc. ■89601A Vector Signal Analyzer Software - Demodulates and analyzes 802.11a/802.11g/HyperLAN2 compatible signals down to the bit level - Automatic detection of 802.11b/g payload data, despreading, descrambling, and demodulation - Analysis of 802.11g signals in OFDM and DSSS/CCK/PBCC modes - Demodulates and analyzes 802.11n formats including duplicate legacy, mixed mode, HT duplicate, and greenfield *For more details, please download the PDF or feel free to contact us.
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The Fukuoka Prefectural Industrial and Scientific Technology Promotion Foundation's Three-Dimensional Semiconductor Research Center has facilities that can design, manufacture, test, evaluate, and analyze embedded substrates with active and passive components wired in three dimensions within printed circuit boards at mass production levels. In addition to a standard printed circuit board manufacturing line, it is equipped with mounting devices for embedding components within the substrate and high-temperature, high-humidity vibration testing equipment to evaluate connection reliability. Furthermore, there is an 8-inch silicon wafer line that allows for the development of test element group (TEG) chips for evaluation. Additionally, it is possible to develop three-dimensional stacking of chips using through silicon vias (TSV) and silicon interposers that use silicon substrates instead of printed circuit boards.
