MIMO receiver tester capable of verification under real environment conditions.
Our company offers the MIMO receiver tester 'N5106A/N7617B', capable of creating and outputting MIMO signals up to 2x2, as well as testing MIMO receivers. It can play waveform files created with the accompanying software, allowing for receiver testing without a transmitter. Using analog I/Q outputs, testing can begin with the receiver in a baseband-only state. 【Features】 ■ Advanced channel emulation ■ Comprehensive channel correlation settings ■ Creation of WLAN signals *For more details, please download the PDF or feel free to contact us.
Inquire About This Product
basic information
【Main Specifications】 ■ Baseband Performance - Modulation/signal capture bandwidth of up to 120MHz - 512 M samples of playback/signal capture memory per channel - Interference/diversity/MIMO testing with up to 6 BBGs and 8 faders - Standard-compliant signal generation: WLAN - Connection with SystemVue software, Signal Studio (N7617B), or playback of proprietary MATLAB(R) waveforms ■ RF Frequency and Amplitude Performance - 100kHz to 6GHz - Output power of +13dBm (at 1GHz) *For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
The Fukuoka Prefectural Industrial and Scientific Technology Promotion Foundation's Three-Dimensional Semiconductor Research Center has facilities that can design, manufacture, test, evaluate, and analyze embedded substrates with active and passive components wired in three dimensions within printed circuit boards at mass production levels. In addition to a standard printed circuit board manufacturing line, it is equipped with mounting devices for embedding components within the substrate and high-temperature, high-humidity vibration testing equipment to evaluate connection reliability. Furthermore, there is an 8-inch silicon wafer line that allows for the development of test element group (TEG) chips for evaluation. Additionally, it is possible to develop three-dimensional stacking of chips using through silicon vias (TSV) and silicon interposers that use silicon substrates instead of printed circuit boards.
![Leak Tester [Reducing Total Costs in Implementation]](https://image.mono.ipros.com/public/product/image/488/2000733364/IPROS42580983377294428256.png?w=280&h=280)
