Equipped with a feature that allows for easy creation of wireless LAN (802.11a/b/g/j/p/n) waveforms!
We offer the vector signal generator 'N5182A/N7617B' that can generate signals in the frequency range of 100KHz to 6GHz. It supports analog modulation such as AM/FM/ΦM/pulse modulation, continuous wave generation, and signal sweeping. Additionally, it can generate wireless LAN signals using software. 【Features】 - High-speed switching for optimizing throughput - Achieves ≦1.2ms in SCPI mode and ≦900μs in list mode for simultaneous frequency/amplitude/waveform switching - Reliable signals with amplitude switching speed and reproducibility can be generated using electronic attenuators (8494B, 8496B) - Wireless LAN signal creation is possible with the software Signal Studio *For more details, please download the PDF or feel free to contact us.
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**Main Specifications** ■ Frequency and Amplitude - 100kHz to 6GHz - +13dBm output power (at 1GHz) ■ Modulation and Sweeping - AM, FM, ΦM, and pulse modulation - Digital step sweeping and list sweeping by switching frequency, power, and waveform ■ Baseband Generation and Signal Creation - Internal baseband generator: 100MHz RF bandwidth, up to 125 Msample/s sampling rate, arbitrary waveform only - Equipped with playback memory of up to 64 Msamples - Capable of storing 100 Msamples - Generation of reference signals: WLAN *For more details, please download the PDF or feel free to contact us.*
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The Fukuoka Prefectural Industrial and Scientific Technology Promotion Foundation's Three-Dimensional Semiconductor Research Center has facilities that can design, manufacture, test, evaluate, and analyze embedded substrates with active and passive components wired in three dimensions within printed circuit boards at mass production levels. In addition to a standard printed circuit board manufacturing line, it is equipped with mounting devices for embedding components within the substrate and high-temperature, high-humidity vibration testing equipment to evaluate connection reliability. Furthermore, there is an 8-inch silicon wafer line that allows for the development of test element group (TEG) chips for evaluation. Additionally, it is possible to develop three-dimensional stacking of chips using through silicon vias (TSV) and silicon interposers that use silicon substrates instead of printed circuit boards.