It can also be powered by batteries, allowing you to carry it and measure in various locations.
We offer the handheld real-time spectrum analyzer 'SA2600', which can capture and measure radio waves flying through the air at various frequencies. It can clearly display small noises that occur unexpectedly and is capable of measuring the entire bandwidth at once. Additionally, it is equipped with GPS and mapping functions, allowing measurement results at each location to be mapped on a map. 【Features】 ■ Channel presets compatible with various standards ■ Unique touch screen interface makes signal tuning and zooming easy ■ In digital RF measurements, signals with pulse durations of 500μs or more can be captured 100% ■ Identifies signals using an innovative Spectrum Correlation Function (SCF) ■ Quickly locates signals with an integrated mapping solution, among others *For more details, please download the PDF or feel free to contact us.
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【Main Specifications】 ■Sampling Rate: Measures over 2,500 spectra per second, detecting transient signals with a minimum of 500μs with 100% accuracy ■Frequency Range: 10kHz to 6.2GHz, with a frequency bandwidth of 20MHz ■Average Displayed Noise Level (DANL): -153dBm, highly sensitive (10Hz RBW) *For more details, please download the PDF or feel free to contact us.
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The Fukuoka Prefectural Industrial and Scientific Technology Promotion Foundation's Three-Dimensional Semiconductor Research Center has facilities that can design, manufacture, test, evaluate, and analyze embedded substrates with active and passive components wired in three dimensions within printed circuit boards at mass production levels. In addition to a standard printed circuit board manufacturing line, it is equipped with mounting devices for embedding components within the substrate and high-temperature, high-humidity vibration testing equipment to evaluate connection reliability. Furthermore, there is an 8-inch silicon wafer line that allows for the development of test element group (TEG) chips for evaluation. Additionally, it is possible to develop three-dimensional stacking of chips using through silicon vias (TSV) and silicon interposers that use silicon substrates instead of printed circuit boards.