You can quickly detect with a timing zoom of 250ps resolution (4GHz)!
We offer the logic analyzer '16823A', which provides timing analysis, logic analysis, and pattern generation functions all in one unit. It can display waveforms, charts, lists, disassembled code, and source code, as well as time-correlated data in a comparative format, allowing for analysis using multiple measurement modes. The measurement channels consist of 102 channels, and the pattern generator is equipped with 48 channels. Additionally, it includes serial bus analysis capabilities and analysis software. 【Features】 ■ Capable of analysis at 1GHz/500MHz (51ch/102ch) ■ The eye finder function automatically adjusts the threshold, allowing for high-accuracy sampling of the synchronous bus ■ The pattern generator can generate patterns with a maximum speed of 300 M vectors/s and a vector length of 16 Mbytes, among other features. *For more details, please download the PDF or feel free to contact us.
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Main Specifications (Configuration) ■ Operation via touch screen is possible ■ Equipped with a collection memory of up to 32Mbyte *For more details, please download the PDF or feel free to contact us.
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The Fukuoka Prefectural Industrial and Scientific Technology Promotion Foundation's Three-Dimensional Semiconductor Research Center has facilities that can design, manufacture, test, evaluate, and analyze embedded substrates with active and passive components wired in three dimensions within printed circuit boards at mass production levels. In addition to a standard printed circuit board manufacturing line, it is equipped with mounting devices for embedding components within the substrate and high-temperature, high-humidity vibration testing equipment to evaluate connection reliability. Furthermore, there is an 8-inch silicon wafer line that allows for the development of test element group (TEG) chips for evaluation. Additionally, it is possible to develop three-dimensional stacking of chips using through silicon vias (TSV) and silicon interposers that use silicon substrates instead of printed circuit boards.