You can see whether the measured object operates within the product specifications or if it breaks.
Our company offers the constant temperature and humidity chamber 'PR-2KP', which achieves high-precision temperature and humidity control and distribution through a refrigeration system equipped with a continuously variable electronic expansion valve. It has 10 built-in measurement program patterns and can store 20 user-created measurement programs. 【Features】 ■ Automatically supplies and drains humidification water from the water distribution system installed at the back of the constant temperature and humidity chamber ■ Eliminates water splashing and condensation drop from the wick pan inside the chamber, preventing any impact on samples ■ Space-saving design for ceiling heat exhaust and reduced operating noise of the device, considering the installation environment *For more details, please download the PDF or feel free to contact us.
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**Main Specifications (Frequency Range)** - Temperature and Humidity Range: -20 to +100℃ / 20 to 98% rh - Temperature and Humidity Variation: ±0.3℃ ±2.5% rh - Temperature and Humidity Distribution: ±0.5℃, ±3.0% rh - Temperature and Humidity Control Method: Balanced Temperature and Humidity Control System (BTHC System) - Capacity: 225L - Internal Dimensions: W500×H750×D600mm - External Dimensions: W910×H1590×D973mm - Weight: 275kg - Power Supply: AC 200V 3Φ 3W 50/60Hz *For more details, please download the PDF or feel free to contact us.*
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The Fukuoka Prefectural Industrial and Scientific Technology Promotion Foundation's Three-Dimensional Semiconductor Research Center has facilities that can design, manufacture, test, evaluate, and analyze embedded substrates with active and passive components wired in three dimensions within printed circuit boards at mass production levels. In addition to a standard printed circuit board manufacturing line, it is equipped with mounting devices for embedding components within the substrate and high-temperature, high-humidity vibration testing equipment to evaluate connection reliability. Furthermore, there is an 8-inch silicon wafer line that allows for the development of test element group (TEG) chips for evaluation. Additionally, it is possible to develop three-dimensional stacking of chips using through silicon vias (TSV) and silicon interposers that use silicon substrates instead of printed circuit boards.