What exactly is substrate-less?

Solving the heat dissipation problem of LEDs! New technology achieves board-less design.

"Board-less" refers to a technology that overturns the conventional concept of heat dissipation by enabling three-dimensional mounting without the use of printed circuit boards, thanks to MARBS (three-dimensional wiring technology), which ideally transfers heat to heat sinks. "MARBS" is a next-generation printed circuit board wiring technology that combines two technologies: "nano-level bonding technology" and "three-dimensional wiring technology." This technology allows for a high level of heat dissipation that was previously impossible with conventional boards, enabling flexible LED light distribution design and the direct formation of wiring patterns on curved metal substrates. 【Differences between MARBS and conventional boards】 - Enables a high level of heat dissipation that was previously impossible - Allows for flexible LED light distribution design - Enables direct formation of wiring patterns on curved metal substrates - Solves LED heat dissipation issues *For more details, please refer to the related link page or feel free to contact us.

Wiring materialsOther processing machinesCircuit board processing machine