We are working on the development of technology and applications to directly form smooth plating on various engineering plastic materials. We are also accommodating prototype requests.
**Features** - Currently capable of plating on polyimide (PI) and Teflon (PTFE). - PI allows for the formation of a smooth plating film. (Development of PTFE and others is ongoing) **Technical Summary** We are developing a method for ensuring adhesion between the resin and the plating film through the formation of a chemical bonding layer, rather than relying on the anchor effect from roughening. **Conventional Technology** Adhesion between the resin and the electroless plating layer is achieved through an anchor structure. **New Technology (Under Development)** Adhesion between the resin and the electroless plating layer is achieved through strong chemical bonding. **Summary of Advantages of the Technology Under Development** We aim to directly plate a smooth plating film on various resins, primarily engineering plastics. **Conventional Technology** - Adhesion Mechanism: Anchor structure - Adhesion Strength: Low strength - Applicable Materials: Limited to materials like ABS (only those that can be roughened) - Smoothness of Plated Surface: Rough (remnants of the anchor structure's unevenness) - Environmental Compliance: Use of hexavalent chromium compounds **New Technology (Under Development)** - Adhesion Mechanism: Chemical bonding - Adhesion Strength: High strength - Applicable Materials: Can be applied to various resins and ceramics - Smoothness of Plated Surface: Smooth, mirror finish possible (no anchor structure needed) - Environmental Compliance: Chromium-free
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【Plating Specifications (Development and Prototype Achievements)】 - Electroless Nickel-Boron (Ni-B): ~0.2μ - Electrodeposited Copper (Cu) on Electroless Plating: 10-20μ - Resin Materials: Polyimide (PI), Teflon (PTFE) 【Challenges We Are Addressing】 - Plating without roughening PTFE - Plating on Liquid Crystal Polymer (LCP), Cycloolefin Polymer (COP), Polyphenylene Ether (PPE), Polyphenylene Sulfide (PPS), Perfluoroalkoxy Alkane (PFA), etc. *Please feel free to consult us for joint application development under NDA.
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We are assuming components related to 5G (for high-frequency and millimeter-wave communication).
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The slogan is "Challenge the Impossible." We are a technology development-oriented company that broadly develops unique surface treatment technologies to meet the special needs required for essential low-voltage components (related to electricity, electronics, and semiconductors), high-voltage components (such as high-voltage connectors), and insulating components. Additionally, we have established a support system that incorporates functional surface treatments, which we have cultivated since our founding, as our core technology, along with processes such as pressing, heat treatment, painting, and assembly. We will continue to deliver consistent Yuden-sha brand technologies and products to the world. *We support online business meetings.