CMP process development, prototyping, and contract processing! With reliable technical skills and experience, we meet our customers' needs.
We would like to introduce our CMP/Dicing business, "MAT Division." We offer services such as "flattening," "smoothing," and "thinning (thin film)," not only in the semiconductor field but also for SiC power devices, SOI, micro-machines (MEMS), optical devices, LED sapphire, organic EL, and more. With our reliable technical expertise and experience, we respond to our customers' needs in advanced technologies such as "grinding," "lapping," "polishing," "CMP," and "cleaning." 【Features】 ■ CMP process development, prototyping, and contract processing ■ "Flattening," "smoothing," "thinning (thin film)" ■ Not limited to the semiconductor field ■ Responding to customer needs with reliable technical expertise and experience *For more details, please refer to the related link page or feel free to contact us.
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Kitagawa Gresstech Co., Ltd. was established through the merger of System Seiko Co., Ltd. and Kemet Japan Co., Ltd. By combining the technology cultivated by System Seiko in HDD polishing equipment with the know-how developed by Kemet Japan in polishing consumables and contract processing for semiconductors and electronic components, we aim to strengthen our sales and development capabilities and further expand our business.
![[Equipment Introduction: Grinding Machine] Excellent dimensional accuracy and surface roughness, ideal for product finishing.](https://image.mono.ipros.com/public/product/image/655/2000740196/IPROS35536553115309873676.jpeg?w=280&h=280)
