Grinding, CMP, dicing, pellet charging, appearance inspection! We offer a wide range of contract processing services.
We would like to introduce our CMP/Dicing business, "STB Division." We handle a wide range of dicing processes for brittle and hard materials such as glass with a film and ceramics, as well as backside grinding (BG) and polishing (CMP) of silicon wafers, dicing processes (bevel cut, step cut), and chip sorting after wafer processing. We serve as a pipeline between manufacturers that produce semiconductor wafers and those that assemble them. 【Features】 ■ Grinding Process: Back Grinding ■ CMP Process: Polishing ■ Dicing Process: Chip Processing ■ Pellet Charge Process: Chip Transfer Processing ■ Visual Inspection Process *For more details, please refer to the related links page or feel free to contact us.
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basic information
【Appearance Inspection Process】 ■Microscopic Observation ■Flexural Strength ■Thickness Measurement (Contact Type) ■Roughness Measurement (Contact Type) *For more details, please refer to the related link page or feel free to contact us.
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For more details, please refer to the related link page or feel free to contact us.
Company information
Kitagawa Gresstech Co., Ltd. was established through the merger of System Seiko Co., Ltd. and Kemet Japan Co., Ltd. By combining the technology cultivated by System Seiko in HDD polishing equipment with the know-how developed by Kemet Japan in polishing consumables and contract processing for semiconductors and electronic components, we aim to strengthen our sales and development capabilities and further expand our business.
![[Processing Reference Example] Casing Screw Machining](https://image.mono.ipros.com/public/product/image/2088546/IPROS16021466541096188662.png?w=280&h=280)