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  6. Embedded PC ADLINK DLAP-3000-CF

Embedded PC ADLINK DLAP-3000-CF

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DLAP-3000-CF

last updated:Jan 11, 2022

Suntex Co., Ltd.
Suntex Co., Ltd.
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DLAP series for edge AI, equipped with 9th/8th generation Core i7/i5/i3, optional MXM graphics module.

Features ■ Width 235 × Height 75 × Depth 182 mm, 3.21 liters ■ CPU 9th/8th generation Core i7/i5/i3/Celeron ■ ADLINK MXM graphics module compatible (Type A/B, maximum 120W) ■ Memory DDR4 SO-DIMM (maximum 64GB) ■ Display 6 DisplayPort (2 CPU + 4 MXM) ■ I/O connectors 4 GbE (1 x i219-LM, 3 x i210-AT), 2 COM

    Embedded Board ComputersProcess Control SystemOther server related
DLAP-3000-CF.jpg

Embedded PC ADLINK DLAP-3000-CF

DLAP-3000-CF.jpg
DLAP-3000-CF.jpg DLAP-3000-CF(1).jpg
  • Related Link - https://www.suntex.co.jp/adlink/adlink_pc.htm#dlap…
  • Special site - Product/service details - https://pr.mono.ipros.com/suntex/product/

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basic information

Specifications ■CPU Core i7/i5/i3/Celeron ■Chipset H310 ■Memory DDR4-2666/2400MHz SODIMM x 2, maximum 64GB ■Hard Disk DDR4-2666/2400MHz SODIMM x 2, maximum 64GB ■Storage M.2 B Key (2280/2242) x 1, 2.5" HDD/SSD x 2 ■Expansion Slot M.2 E Key (2230/1630) x 1 ■I/O Connectors GbE (i219-LM) x 1, GbE (i210-AT) x 3 (RJ-45), USB 3.2 (Gen1) x 6, USB 3.2 (Gen1) x 4, USB 2.0 x 4, RS-232/422/485 x 1, DisplayPort x 6 (2 CPU + 4 MXM), DIO (4 in/4 out) x 1 (optional) ■Input Power DC 12V input (optional 240W AC adapter) ■Dimensions/Weight 235(W) x 75(H) x 182(D) mm / TBD ■Operating Temperature 0 to 50℃

Price information

Open price

Delivery Time

Please contact us for details

※The delivery date may vary depending on the quantity, so please feel free to contact us.

Applications/Examples of results

MRI and CT scans in healthcare, infrared cameras, embedded applications/passive cooling applications.

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Model number overview
DLAP-3000-CFP1 EGX-MXM-P1000, Chipset H310
DLAP-3000-CFP2 EGX-MXM-P2000, Chipset H310
DLAP-3000-CFP12 No MXM module, Compatible MXM modules: EGX-MXM-P1000/2000, Chipset H310
DLAP-3000-CFP3 EGX-MXM-P3000, Chipset H310
DLAP-3000-CFP5 EGX-MXM-P5000, Chipset H310
DLAP-3000-CFP35 No MXM module, Compatible MXM modules: EGX-MXM-P3000/5000, Chipset H310
DLAP-3000-CFT1 EGX-MXM-T1000, Chipset H310
DLAP-3000-CFT3 EGX-MXM-RTX3000, Chipset H310
Option Memory 8GB/16GB/32GB/64GB Upgrade 2.5" SATA SSD/HDD/M.2 240W Industrial AC Adapter Wall Mount Bracket

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Embedded PC ADLINK DLAP-3000-CF Product Catalog

Embedded PC ADLINK DLAP-3000-CF Product Catalog

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Company information

Suntex

Suntex Co., Ltd.

Industrial Electrical Equipment

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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.

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