Ultra-precision fine machining

Solving your grinding and polishing problems with "hard materials" such as ceramics and cemented carbide! If you have been turned away by other companies, leave the ultra-precision processing of difficult-to-cut materials to us.

Since our establishment, we have been engaged in the contract processing of precision parts for production equipment in the semiconductor and electronic components industry. The advanced processing technology we have cultivated by continuously meeting our customers' high precision requirements is named "Bisei Processing." This technology enables us to create beautifully intricate shapes, akin to traditional crafts, in response to our customers' needs. 【Supported Materials】 ■ Ceramic materials including cemented carbide, alumina, and zirconia. ■ We also precisely process difficult-to-cut materials such as silicon carbide and silicon nitride. We can process materials provided by customers, and we also respond to requests for material procurement using our extensive network. Please feel free to consult us for technical inquiries or estimates. 【Processing Methods】 ■ Microprocessing ■ Cutting processing ■ Grinding processing ■ Wire electrical discharge machining *For more details, please refer to the PDF document or feel free to contact us.

Other moldsProcessing ContractCeramics