Achieving safe and highly reliable transport of ultra-thin wafers by utilizing three types of end effectors!
We would like to introduce the "Ultra-thin Wafer Handling End Effectors" manufactured by Mechatronic System Technik in Austria, which we handle. These include the "Bernoulli Vacuum End Effector," the "Top Grip End Effector," and the "Contactless End Effector." By utilizing these three types of end effectors, we achieve safe and highly reliable handling of ultra-thin wafers. 【Types】 ■ Bernoulli Vacuum End Effector ■ Top Grip End Effector ■ Contactless End Effector *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications (Excerpt)】 ■ Bernoulli Vacuum End Effector - Blowing Medium: Air or N2 - Pressure: 150-300 kPa - Consumption: 60-90 l/min ■ Top Grip End Effector - Blowing Medium: Air or N2 - Pressure: 150-250 kPa - Consumption: 60-90 l/min ■ Contactless End Effector - Blowing Medium: Air or N2 - Pressure: 150-300 kPa - Consumption: 60-120 l/min *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■ For ultra-thin wafer transport *For more details, please refer to the PDF document or feel free to contact us.
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Delixon Technology Japan Co., Ltd. engages in the buying and selling of used semiconductor equipment and peripherals, as well as providing repair services for robots, RF power supplies, matching boxes, VAT valves, and other peripherals related to semiconductor manufacturing equipment.