Cleanliness is compatible with Class 10! Coin stack packaging and unpacking device for thin wafers.
The "PT150/200/300" is a device that automatically transports wafers non-contact from ultra-thin wafers to standard wafers using a Bernoulli end effector, and packages and unpacks coin stacks (horizontal orientation). It can automatically refill between coin stack (horizontal orientation) shipping boxes and carriers (FOUP, cassette). It is compatible with various coin stack (horizontal orientation) packaging boxes and inserts (protective paper, films, etc.) regardless of the manufacturer. 【Features】 - Supports thin wafers - Compatible with various coin stack (horizontal orientation) packaging boxes and inserts regardless of the manufacturer - Can be specified as a coin stack loader and unloader for grinders, analyzers, and defect inspection devices *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications (Excerpt)】 ■ Operation Method: Touch Screen Panel ■ Cleanliness Level: Class 10 Compliant ■ Standards: Compliant with CE, SEMI-S2, S8 ■ Throughput: 180 sheets/hour (20 seconds/sheet) ■ Required Facilities: N2 or Air (0.6-0.7MPa) ■ Power Supply: 100-200VAC 50-60Hz *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■Ultra-thin wafers, standard wafers *For more details, please refer to the PDF document or feel free to contact us.
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Delixon Technology Japan Co., Ltd. engages in the buying and selling of used semiconductor equipment and peripherals, as well as providing repair services for robots, RF power supplies, matching boxes, VAT valves, and other peripherals related to semiconductor manufacturing equipment.