Providing various backend packaging and assembly solutions for semiconductor devices!
We would like to introduce our solutions specialized for the semiconductor industry. The "liquid dispensing tool" can accurately apply adhesive to substrates, effectively preventing variations in epoxy resin such as tailing, bridging, dimpling, and insufficient epoxy coverage. It provides excellent application performance to our customers. In addition, we offer a wide range of products including the "fine wire wedge bonding tool" and the "solder jet ball dispenser."
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basic information
【Backend Packaging and Assembly Solutions】 ■ Active/Passive Components, Integrated Circuits (IC) ■ CPU (Central Processing Unit) ■ ASIC (Application-Specific Integrated Circuit) ■ Transistors, Capacitors, Diodes ■ Power Devices (IGBT) 【Related Products】 ■ Liquid Dispensing Tools ■ Fine Wire Wedge Bonding Tools ■ Solder Jet Ball Dispenser ■ Manual Wire Bonder Work Holder ■ Die Collet, Pick & Place Tools *For more details, please refer to the related links page.
Price range
Delivery Time
Applications/Examples of results
For more details, please see the related link page.
Detailed information
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Liquid dispensing tool
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Fine wire wedge bonding tool
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Solder Jet Ball Dispenser
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Fine wire wedge bonding tool
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Manual wire bond work holder
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DaiColette, pick and place tool
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Company information
Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.