For EV battery assembly and more! Providing solutions for various applications in the automotive and EV industries.
We would like to introduce our solutions specialized for the automotive industry. The "liquid dispensing tool" provides excellent application performance to our customers. It allows for precise application of adhesive to the substrate, effectively preventing variations in epoxy resin such as tearing, bridging, indentations, and insufficient epoxy area ratio.
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basic information
In addition, we provide solutions for various applications in the automotive and EV industries, such as "fine wire wedge bonding tools" and "manual wire bonder work holders," in response to the increasing demand for car electronics. 【Related Products】 ■ Liquid dispensing tools ■ Fine wire wedge bonding tools ■ Manual wire bonder work holders ■ Die collets, pick and place tools *For more details, please refer to the related links page.
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Applications/Examples of results
【Applications】 ■ EV battery assembly ■ Manufacturing power devices for subsystems such as ABS ■ Automotive electronics assembly *For more details, please see the related link page.
Detailed information
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Liquid dispensing tool
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Fine wire wedge bonding tool
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Fine wire wedge bonding tool
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Manual wire bond work holder
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DaiColette, pick and place tool
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Company information
Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.