Supporting the growing IoT industry! Providing packaging and assembly solutions for products!
We introduce solutions specialized for the IoT industry offered by Micro Point Pro Co., Ltd. The "fine wire wedge bonding tool" guarantees high yield and stable bonding results. Continuous development of materials and design allows for the optimization of bonding performance.
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basic information
We provide packaging and assembly solutions for products such as hard disk drives, wireless components, and power management devices, supporting the growing IoT industry. 【Related Products】 ■ Fine Wire Wedge Bonding Tools ■ Die Colette, Pick & Place Tools ■ Liquid Dispensing Tools ■ Solder Jet Ball Dispenser 【Packaging and Assembly Solutions for Products】 ■ Hard Disk Drives ■ Wireless Components ■ Sensors ■ Power Management Devices ■ Microcontrollers *You can also download the PDF materials from below.
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You can also download the PDF materials from below.
Detailed information
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Fine wire wedge bonding tool
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DaiColette, pick and place tool
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Liquid dispensing tool
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Solder Jet Ball Dispenser
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Company information
Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.