【Equipment Introduction】Understanding the internal condition of electronic components with the 'X-ray Inspection System'

Conducting inspections of components that are not visible from the surface of bottom electrode products such as BGA/CSP! Detecting foreign objects with advanced image processing technology to ensure the provision of safe and secure products.

At Astom, we have introduced an "X-ray inspection system" for inspecting components that are not visible from the surface of bottom electrode products such as BGA/CSP. We have established a system that detects foreign matter and product defects using advanced image processing technology, ensuring the delivery of safe and secure products of high quality. ~Details of Inspection Equipment~ User-friendly micro-focus X-ray inspection system Safe structure with leakage radiation levels below 1 microsievert. The XY table can be automatically controlled for positioning, and the teaching function makes repetitive tasks easy. The X-ray irradiation angle can swing up to 60 degrees forward and backward and 30 degrees left and right (L-type). With the standard analysis software, dimension measurement and 3D display (L/D type) are possible. A manipulator allows for 360-degree observation of small components. The D-type, using a digital I.I. tube, provides clearer images. For challenges and concerns related to such substrates, Astom, with over 20 years of experience, offers various solutions. Please feel free to consult us regarding any issues related to mounted substrates. *For more details, please download the materials or contact us.*

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