Providing build-up substrates using ultra-thin materials, laser vias, and via stack technology!
Shinko Manufacturing Co., Ltd. supplies products that satisfy our customers through technological development. We provide build-up substrates using ultra-thin materials, laser vias, via-fill plating, and via-stack technology. We have a proven track record in mass production of double-sided printed circuit boards, multilayer printed circuit boards, LED circuit boards, cavity printed circuit boards, and build-up printed circuit boards. 【Mass Production Achievements】 ■ Double-sided printed circuit boards ■ Multilayer printed circuit boards ■ LED circuit boards ■ Cavity printed circuit boards ■ Build-up printed circuit boards ■ Thin high-density printed circuit boards *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Mass Production Example】 <6L (2-2-2 BU)> ■Core Thickness: 200um ■Prepreg Thickness: 60um ■Total Board Thickness: 0.57mm ■Materials Used: Equivalent to FR-4, FR-5, BT Material ■Via/Land: φ0.10/φ0.20mm ■Hole Filling Method: Via fill copper plating, resin filling, copper paste filling ■L/S: 60um/60um ■Surface Treatment: Electroless Ni/Pd/Au, Electroless Gold, Electrolytic Gold, Electrolytic Silver, Flux *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Shinko Seisakusho Co., Ltd. operates as a company within the Sumitomo Metal Mining Group, primarily engaged in the development, design, manufacturing, and sales of electronic circuit boards. Our company conducts integrated production across all processes from design to prototype and mass production. Additionally, we not only focus on domestic production but also select overseas OEM partners according to our customers' needs for procurement and sales. If you have any inquiries regarding electronic circuit boards, please feel free to consult with us.