In the process, it is possible to have a thickness difference in Sn plating (reel to reel)! The amount of tin shavings during insertion and secondary pressing can be significantly reduced!
**Previous Issues** In conventional tin plating, it has been difficult to maximize the characteristics of both the press-fit and soldering areas, and the generation of tin shavings after secondary processing has been a challenge. **Effects** - Plating of varying thicknesses has become possible. - By reducing the thickness of the coating on the press-fit area, we can suppress tin shavings during insertion, while increasing the thickness of the soldering area helps maintain solderability. - When performing secondary processing, exposing the underlying nickel in the bent section significantly reduces the occurrence of tin shavings. - By conducting reflow treatment, we suppress the occurrence of whiskers. Additionally, by performing the treatment at an optimal temperature for the specified coating thickness, we can prevent the formation of wrinkles and rough surfaces in the plating. Please feel free to contact us with any questions, no matter how trivial!
Inquire About This Product
basic information
Differential thickness Sn reflow hoop plating is a plating process that allows for the differentiation of the thickness of the tin plating between thick and thin areas. Since tin plating is prone to whisker formation, it is often subjected to reflow treatment after plating. This reflow treatment helps suppress the occurrence of whiskers. Mitsuya's reflow line processes tin plating twice, allowing for different thicknesses in the press-fit and soldering areas, thereby enhancing the characteristics of each. In the case of full tin plating, there may be tin shavings adhering to the mold during secondary processing after plating. However, Mitsuya's differential thickness Sn reflow hoop plating exposes the underlying nickel in the areas that contact the mold, preventing the adhesion of shavings. *The underlying layer is fully nickel plated. *If there are bends, separate consultation is required.
Price range
Delivery Time
Applications/Examples of results
【Application】Automobiles - IGBT, electronic components, electrical and electronic - busbars, etc. 【Issues that can be addressed】Whisker generation countermeasures, good soldering and good joint quality.
Detailed information
-
New method: Differential thickness Sn reflow hoop plating
-
Conventional: Sn full plating
catalog(2)
Download All CatalogsCompany information
Mitsuya is a company that specializes in metal surface treatment and plating, founded in 1931. We focus not only on general plating but also on plating for difficult materials, offering around 90 different types of plating. Currently, plating has become an essential part of advanced technologies such as IT, electronic devices, ubiquitous computing, next-generation energy, next-generation motorization, and environmental technology. In this context, Mitsuya Co., Ltd. responds to customer needs with a spirit of "let's give it a try" to meet strict requirements, earning a reputation for being the go-to company when faced with challenges. We have established partnerships with many companies, including those in the manufacturing of electronic and electrical devices, as well as automotive and transportation equipment. We will propose the most suitable plating technology based on your consultation needs. We also accommodate small-scale prototypes starting from just one piece, so please feel free to contact us with any inquiries, no matter how trivial.