[Case Study] Coating Suitable for Copper Materials with High Thermal Conductivity

Solving issues related to copper oxide films! Introducing cases where improvements have been made!

We would like to introduce a case study that addresses the challenges faced by device manufacturers and component manufacturers. [Challenges] Copper materials, known for their high thermal conductivity, are often used in heat sources and similar applications. At the typical processing temperature for fluorine coatings (380°C), an oxide film forms on copper, leading to delamination between the oxide film and the copper material. As a result, coating materials that require high processing temperatures cannot be used. This presents several issues, including many differences from standard surface treatments and lower durability. [Improvements] We have been able to improve the situation by using a coating material that has a low processing temperature, suppresses the formation of the copper oxide film, and offers heat resistance comparable to fluororesin. The non-stick properties and durability are also significantly enhanced. (Product model number KP-491-1) *For more details, please refer to the PDF document or feel free to contact us.

Coating Agent