High electrical insulation! We would like to introduce plating technology that achieves improved performance of semiconductor devices.
Our "plating on ceramics" has high electrical insulation properties and excellent heat dissipation. There are two types of circuit formation methods: the "subtractive method," which has a flat circuit surface and excellent surface mountability, and the "semi-additive method," which allows for narrow pitch copper patterns. Plating can also be applied to through holes, and it is compatible with materials such as alumina, zirconia, and zinc oxide. 【Features】 ■ High electrical insulation ■ High thermal conductivity ■ Excellent heat dissipation ■ Low thermal expansion rate *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Circuit Formation Method】 ■ Subtractive Method Material → Seed Layer Formation → Electroplating → Resist Formation → Etching → Resist Removal ■ Semi-Additive Method Material → Seed Layer Formation → Resist Formation → Electroplating → Resist Removal → Seed Layer Removal *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Since its establishment in 1946, the company has continuously refined and innovated its technology development, consistently anticipating the intense changes in the times and markets, while responding to cutting-edge needs in surface treatment. In particular, based on the addition of required functions, the technology and management standards in plating processes, centered on "electroplating" and "electroless plating," which require advanced technology and quality such as adhesion, corrosion resistance, and precision, are recognized as top-level in the industry, earning high evaluation and trust from customers. *The company name was changed from "Ebina Denka Kogyo Co., Ltd." on April 1, 2024.