Introducing a composite circuit component that modularizes circuit blocks into a single functioning device.
The "HIC Module Hybrid IC" is a composite circuit product that forms circuits by mounting various chip components on ceramic substrates and glass epoxy substrates, functioning as a single module. It enables miniaturization, reduction of mounting costs, black-boxing of circuits, and rationalization of component management. Additionally, it can be customized according to the user's preferences. 【Benefits of Modularization】 ■ Miniaturization ■ Reduction of mounting costs ■ Design changes ■ Black-boxing of confidential circuits ■ Rationalization of component management *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
About HIC Modules Using Thick Film Printing Technology ■ Circuits are formed by high-temperature sintering silver electrodes on alumina substrates with excellent thermal conductivity. ■ The resistors are printed with metal film resistors and trimmed with a laser, allowing for free design and placement. ■ Utilizing advantages such as heat resistance, weather resistance, and thermal conductivity, they are used in applications like LED lighting substrates. *For more details, please refer to the PDF document or feel free to contact us.*
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【Applications】 ■Control equipment ■Machine tools ■Medical devices (handheld type) ■Industrial machinery (various controller circuits) ■Sensor circuits ■Amusement equipment ■LED lighting equipment ■Various home appliances *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Fukushima Suwa Electric Co., Ltd. applies its innovative technologies, cultivated through the development and manufacturing of various resistors, such as coating technology, printing technology, and metal processing technology, to continue challenging new fields, including glass touch panel LED lighting circuits and circuit products for clean energy.
![Hybrid I.C [Achieving optimal circuit configuration and external structure!]](https://image.mono.ipros.com/public/product/image/e2e/2000331967/IPROS6710698881158783288.jpg?w=280&h=280)
