Joining services using low melting point solder such as indium (In) and tin (Sn). We also accept inquiries for prototypes.
The solder materials used for joining metals and ceramics, such as sputtering targets and electrostatic chucks, typically consist of low melting point metals like indium. In response to customer requests to match the solder materials to the temperature range of use, we have developed specialized solder materials to provide optimal solutions for specific purposes and applications. <Features> By alloying materials from indium (melting point 156°C) to materials with melting points up to 1000°C, and if the compatibility between the target material and the alloy solder is poor, we propose the optimal joining method for each material and shape by combining surface treatment through sputtering deposition. <Target Markets> Electronics, materials, chemicals, energy sectors, and others.
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basic information
<All Equipment and Quantity> - Hot plates: 4 units - Water immersion ultrasonic flaw detector: 1 unit - Sputtering deposition equipment: 7 units - Electric microscope: 1 unit - Calipers and dial gauges: multiple units - Sandblaster: 2 units - Dry ice blaster: 2 units
Price range
P2
Delivery Time
P3
Applications/Examples of results
- Sputtering target - Electrostatic chuck
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Company information
A company that can respond instantly to the rapidly changing information society, that is Kyodo International. It has been 50 years since the company was founded. And a new challenge! We will face difficulties more strongly and boldly than ever. We look forward to your continued support.