Possible to manage preservation and improve quality! Compound semiconductor grinding machine that shapes core ingots.
The "SBC-150S" is a peripheral blade cutting device that cuts and shapes the ends of ingots and cores made of semiconductor compounds. The setup and alignment of the ingot (workpiece) are done manually, and the ends of the ingot are cut with a peripheral blade (diamond blade). By adding various sensors linked to an IoT system and performing data sensing, maintenance management and quality improvement are possible. 【Features】 ■ Cuts and shapes the ends of ingots and cores made of semiconductor compounds ■ Manual setup and alignment of the ingot (workpiece) ■ Cuts the ends of the ingot with a peripheral blade (diamond blade) ■ The cutting fluid is circulated from the coolant tank for cooling and cleaning *For detailed information and product catalogs, please access the related links.
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【Specifications (Excerpt)】 <Utility> ■ Power Supply: 20kVA 200V ■ High Pressure Air: 0.5MPa or higher ■ Exhaust: 8m³/min including mist <Coolant Tank (Optional)> ■ Capacity: 200L ■ Pump: 1kW 200V <Electric Chain> ■ Rated Load: 800kg ■ Rated Voltage: 200V <Device Dimensions> ■ W×D×H: 3,500×2,300×2,700 *For detailed information and product catalog requests, please access the related link.
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For those who wish to receive detailed information or a product catalog, please access the related link.
Company information
ERS Corporation was founded in 2015 with the purpose of "contributing to society through the planning and construction of automation systems" in Murakami City, Niigata Prefecture. Although the company is relatively new, our representatives and staff have extensive experience in manufacturing sites, including: - "Experience" from numerous successes and unimaginable failures - "Planning and idea generation skills" cultivated from various experiences - "Implementation ability" to turn even the smallest details into reality These are our company's greatest strengths.
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