Conduct data analysis and shape measurements before and after use, as well as for dust-related issues, and provide feedback to customers!
At Riboras Co., Ltd., we conduct analysis and measurement of parts within semiconductor manufacturing equipment. We perform data analysis and shape measurement before and after use, as well as for dust-related issues, and provide feedback to our customers. Based on the analysis results, we identify factors causing issues and propose changes in shape or material, as well as improvements for extending product lifespan. [Analysis Overview] ■ Laser scan measurement: Non-contact cross-sectional shape ■ 3D image analysis: Shape confirmation in three dimensions ■ Deterioration analysis: Comparison of deterioration with new products ■ SEM (EDX analysis): Component analysis of contaminants and materials ■ X-ray analysis: Component analysis of metal-based materials *For more details, please refer to the PDF document or feel free to contact us.
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【Other Analysis Overview】 ■FT Infrared Spectrophotometer: Analysis of rubber and resin ■Thermogravimetric Gas Chromatography Mass Spectrometry: Outgas analysis through thermal heating ■Cross-sectional Film Observation: Analysis of film thickness and surrounding ■Transmittance Measurement: Analysis of transmittance for materials like glass ■Others: Analysis using various measurement instruments *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company provides repair services for auxiliary equipment for semiconductor manufacturing devices, as well as the design of new parts. We also offer surface treatment and modification, such as anodizing and plating. Please feel free to contact us if you have any requests.