We realize that our Daibonder has very high versatility! An explanation of bonding materials and bonding methods.
It is always interesting to learn about the chemicals used by customers in bonding technology. There are many factors to consider. Due to the diversity and characteristics of materials, such as low viscosity, high viscosity, and thixotropic media, it is necessary to take multiple parameters into account when selecting materials suitable for the application. Even more importantly, it is essential to invest in equipment that can build a profile that allows for a phased bonding process and ensures a seamless roadmap to the production process. Here, Finetech can make an impact on your research and development. In this blog, we introduce "bonding materials and bonding methods." *For more details, you can view the PDF materials. Please feel free to contact us for more information.*
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*You can view the detailed content of the blog in the PDF document. For more information, please feel free to contact us.*
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*You can view the detailed content of the blog in the PDF document. For more information, please feel free to contact us.*
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Company information
Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.