Two important variables to consider when choosing a device are speed and throughput!
In the world of contract manufacturing, we must consider the projects that may come in at any time. Therefore, to determine what kind of equipment to purchase, it is necessary to take into account many variables (factors). To ensure that contract manufacturers can produce high-quality products while competing, a suitable set of production equipment is required. In the world of contract manufacturing, it is not uncommon to handle dozens of products, ranging from small-scale items with fewer than 100 units to mass production. In the case of OEM, there may be a need to assemble thousands of products. This blog introduces the topic of "Speed vs Throughput." *For more detailed information, you can view the PDF materials. Please feel free to contact us for more details.*
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*You can view the detailed content of the blog in the PDF document. For more information, please feel free to contact us.*
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*You can view the detailed content of the blog in the PDF document. For more information, please feel free to contact us.*
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Company information
Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.