This conveyor, which uses a mounting machine (mounter) used in semiconductor devices, contributes to automation by achieving high-speed and high-precision supply of tape and seals!
By combining the FILM FEEDER with the mounting machine (mounter), it has become possible to transport tapes and seals that were previously done manually (adhesive application)! With just one mounter, it is now possible not only to mount electronic components but also to pick and place works such as seals and tapes. The FILM FEEDER connects to Yamaha Motor's mounter and is a device that can quickly and stably transport and peel off adhesive or non-adhesive works mounted on PET film individually. We have compiled the available works for easy reference, so please take a look. 【Features】 ■ Adhesion while peeling off the work (adhesion on the backing paper) ■ Simultaneous adhesion method ■ Peeling and adhesion on the base film ■ Attachment without damaging the adhesive surface ■ Peeling and adhesion of fine, extremely small, and non-rigid works 【Compatible Tapes】 ■ Irregular tapes ■ Extremely thin tapes ■ Non-rigid tapes ■ Sponge/porous materials ■ Metal parts ■ Non-adhesive tapes ■ Polyimide tapes ■ Fine tapes ■ Extremely small tapes ■ Double-sided tapes *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 - Collaboration with seal processing manufacturers allows for proposals from material processing. - Possession of Yamaha Motor Co., Ltd. Mount YS12P verification film feeder in 32mm and 104mm widths. - A system has been established to conduct test work production and attachment experiment verification. 【Device Specification Examples】 - Automation of current lamination processes, such as polyimide and double-sided tape mounting on standard circuit boards and mounting on flexible substrates. 【Work Usage Examples】 - Reinforcement plate attachment - PI (polyimide) attachment - Lamination processing - Noise countermeasures / attachment of shielding materials - Cover layer attachment - Flexible antenna reflective material assembly - FPC multilayer assembly - Attachment of waterproof vent films to MEMS microphones and sensors - Attachment of cushioning materials to housings and contact areas - Attachment of mechanical parts / waterproof seals - Assembly of optical units (light guides, diffusion films, etc.) - Attachment of PI and other materials to mounted circuit boards *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company is focusing on creating new value in manufacturing by leveraging our two strengths: "measurement and control technology" and "design and assembly technology for precision equipment parts." In the field of non-destructive inspection equipment for fruits and vegetables, where we have accumulated technology as a pioneering company for many years, we have expanded our focus from traditional measurements centered on the sugar content of fruits to inspections of internal rot, cavities, and browning in vegetables. By developing machines that can accurately inspect fruits and vegetables, which have variations in shape and quality, even under harsh usage conditions, we are making a significant contribution to the quality assurance of internal produce in Japanese agriculture. Additionally, in the field of electronic component mounting, we have been engaged in OEM and ODM production of tape feeders and surface mount technology for over 30 years, featuring production facilities that can flexibly accommodate everything from small quantities of diverse products to mass production. Recently, we have also developed original splicing jigs that realize labor-saving in board mounting, leveraging our long-standing technology and experience. This has already attracted inquiries from many companies and received high praise from the market.