Leave the processing of semiconductor wafers and the shipment of bare dies to us!
We handle assembly processing of semiconductor wafers. - Available wafer diameters: 6 to 12 inches - We can perform back grinding (backside polishing) of wafers only, and shipping after dicing with laser grooving/blade is also possible. - The thickness distribution of wafers after backside polishing can be measured non-contact and non-destructively. - We can pick up specific dies from shuttle wafers and ship bare dies or perform package assembly. - If you provide the results of wafer tests in a map format, we can also accommodate inkless processing. - The condition of both sides of the dies will be inspected in full by automatic visual inspection machines. - For bare die shipments, you can choose between tray, dicing tape, or embossed tape (reel) packaging. 【Business Content】 - Processing and shipping support after the supply of semiconductor wafers - Automatic visual inspection of the front and back surfaces of wafers - Evaluation and analysis in the latter processes associated with die development
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basic information
【Example of Work Flow】 - Wafer acceptance - Receipt of map data / Equipment deployment - Wafer back grinding - Measurement of thickness distribution after wafer back grinding (non-contact/non-destructive measurement possible even with wafers having protective tape on patterned areas) - Wafer dicing (laser grooving, blade processing) - Visual inspection of all sides of the die - Wafer packaging, die packaging (consultation available for tray or dicing tape, embossed tape (reel) packaging, etc.) *Assembly processing for die packaging is also possible.
Price range
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Applications/Examples of results
Outsourcing of semiconductor wafer processing, bare die shipment.
Company information
Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.