Surface mounting in a clean room! We also accept integrated production with various package assemblies.
■ Surface mounting is performed in a Class 10000 environment. ■ We select the supply method for solder and adhesive according to the product using printing, dispensing, and pin transfer. ■ We have production experience with FPCs with component sizes of 0402, a distance between components of 0.13mm, and a substrate thickness of 0.5mm or less. ■ We can accommodate laser soldering (local soldering). ■ We also support surface mounting on individual substrates. ■ We provide post-surface mounting services such as automatic visual inspection, flux cleaning, underfill, substrate cutting, and marking. Additionally, we can offer integrated support combined with various package assembly, so please consult with us. ■ We can also handle various analyses in-house, so please inquire.
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basic information
■Component Mounting Line Supported component sizes: 0402 chip to 100×90mm, PCB supported sizes: 50×50mm to 330×250mm Solder supply method: Solder printing: from 0402, dispensing machine: from 0603 Adhesive supply method: Dispensing supply, pin transfer Component supply method: Taping (Width: 8 to 104mm/Pitch: 2 to 76mm), tray (Max: 330×230mm), stick, bulk Odd-shaped mounting machine: Flux transfer mounting possible (BGA / WL-CSP) N2 Reflow Oven: Hot air type: 9 zones (preheat: 7 zones, heating: 2 zones), hot air type: 10 zones (preheat: 8 zones, heating: 2 zones) Laser soldering: Possible ■Standalone Equipment Automatic visual inspection machine (hybrid optical type), underfill (jet dispense), marking (ink/laser) Flux cleaning, PCB cutting machine
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Applications/Examples of results
[An Example of Production Results] Camera Module (FPC: WL-CSP / Chip Components / Connector) Wireless Communication Module (FR4: WL-CSP / Chip Components / Shield Case)
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Company information
Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.
