3D Printed Circuit Board (Raw Substrate) Surface Inspection Device 'ATHENA'

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last updated：May 16, 2022

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For 3D measurement of various substrates. Inspections that eliminate errors caused by shadows are possible! We are also providing materials that introduce features and examples of defects detected from actual inspections.

"ATHENA" is a 3D printed circuit board surface inspection device that achieves high-precision detection of dents, bubbles, foreign objects, and more by rendering 3D images through moiré pattern projection. The new head type has been upgraded from the existing head using technology accumulated over several decades to enable the rendering of real images. By utilizing 12-way and 16-way projectors, in addition to the existing 8-way projector, inspections can be performed on various shapes of circuit boards without errors caused by shadows. You can view a document detailing various performance features, characteristics, and case studies available for PDF download. 【Features】 ■ Spacious design and convenient maintenance ■ Simple assembly and setup ■ 3D formation of high-density components and components in narrow spaces ■ 3D formation identical to real images ■ Improved repeatability accuracy *For more details, please refer to the PDF document or feel free to contact us.

Related Link - http://www.pentron.co.jp/products/printed_board/00…

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【Other Features】 ■ 4-Way Side Camera (Optional) ■ Can detect the inner bridge that cannot be checked with the top camera ■ Capable of inspecting the inside of connectors ■ Convenient teaching using algorithms ■ Real-time inspection algorithm for side cameras *For more details, please refer to the PDF document or feel free to contact us.