Conductive heat-resistant protective tape using PI and PEN. Usable on various wafers such as MEMS, CMOS, and IGBT. Also suitable for wafer surface protection applications.
This is a conductive heat-resistant protective tape made from PI and PEN, which have undergone our unique conductive treatment, and uses silicone and heat-resistant acrylic adhesive. By applying it to glass wafers or glass support wafers, it enables electrostatic chucking at low voltage. It can be used with various wafers such as MEMS, CMOS, and IGBT. Additionally, due to its heat resistance of over 200°C and chemical resistance, it can also be used for wafer surface protection applications. **Features** - Can be repurposed for conventional semiconductor equipment - High transparency allows for image recognition through the film - Safe for use in plasma processes due to low outgassing and low ion contamination - The substrate and adhesive have heat and chemical resistance, making them suitable for baking and chemical cleaning For more details, please contact us or refer to the catalog.
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basic information
**Physical Properties** <Part Number: STSI-PEN#25> Base Film: PEN Usable Temperature: Below 180℃ Surface Resistivity (Substrate Side): 1.3×10^5Ω/□ *High Resistance Meter Surface Resistivity (Adhesive Side): >1.0×10^13Ω/□ *High Resistance Meter Dissipation Time: <0.3sec. *FTM 101C-4046 (23℃×15%RH) Adhesion (to Glass): 0.18N/25mm *170° Peel Test Outgassing: 34μg/g *170℃, 10min Total Light Transmittance: 75% *JIS K 7105 <STSI-PI#25> Base Film: PI Usable Temperature: Below 300℃ Surface Resistivity (Substrate Side): 1.3×10^5Ω/□ *High Resistance Meter Surface Resistivity (Adhesive Side): >1.0×10^13Ω/□ *High Resistance Meter Dissipation Time: <0.3sec. *FTM 101C-4046 (23℃×15%RH) Adhesion (to Glass): 0.18N/25mm *170° Peel Test Outgassing: 43μg/g *170℃, 10min Total Light Transmittance: 47% *JIS K 7105
Price information
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Price range
P2
Delivery Time
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Applications/Examples of results
Wafer protection for various semiconductor manufacturing processes such as CVD, sputtering, plasma etching, chemical etching, and baking. For electrostatic chuck applications.
Line up（2）
| Model number | overview |
|---|---|
| STSI-PEN#25 | Base film: PEN |
| STSI-PI#25 | Base film: PI |
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Company information
Achilles, with plastic processing technology as its core technology, delivers a wide range of products that support daily life and industry, from everyday consumer goods to advanced electronics components, to the world.
