Introducing the design functions required for Co-packaged Optics Design and the functions necessary for manufacturing design from 3D module design.
This document introduces the features of the CAD/CAM integrated programming tool "START." In the construction of the Co-packaged Optics Design environment, we cover important items such as the utilization and customization of "START," the establishment of design flows, and the development of design environments compatible with optical waveguides. Additionally, we also introduce the main functions of 3D module design. We encourage you to read it. [Contents (partial)] ■ Construction of Co-packaged Optics Design environment ■ Design functions required for Co-packaged Optics Design ■ Verification of connection pattern wiring between chips and BGA through 3D structuring ■ Introduction of START case studies… GDS editing/wiring/3D inspection/analysis models ■ Introduction of minimal fab sample data *For more details, please refer to the PDF document or feel free to contact us.
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【Other Published Content】 ■Introduction to the main features of 3D module design ■Functions necessary for manufacturing design from 3D module design ■Synthesis check of 3D circuit wiring and dielectric structure ■3D structural functions of conductors and dielectrics with unlimited layer configuration ■Summary *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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The Heterogeneous Integration Tool is a pioneer in mixed technologies. START is a unique CAD/CAM/3D integration tool in the electronics industry. It allows for easy recognition of connections in 3D stacked circuits for LSI/PKG/Board within a seamless single database, enabling pathfinding and modeling. Due to its adoption in "ASET," it has been utilized in several national projects and research institutions. It has been adopted by "PETRA" and continues to be used by IO Core Co., Ltd. Additionally, it has been employed in quantum computer 3DIC applications (such as 3D stacking of chips). From design to manufacturing design and direct control of manufacturing equipment through custom software, it enables efficient collaboration and centralized data management via a unified database (ASCII public). By leveraging the industry's first dedicated programming language standardly included in the system, it incorporates the exceptional proprietary technologies of predecessors into the system, providing automation for data checking, modeling, drawing creation, and equipment interfaces. It supports "cost and quality" through high yield by enhancing the accuracy and speed of development progress, as well as centralized management and reuse of resources.