Introducing the operational examples of "Start," which enabled the standardization of analysis models, such as the modeling of parasitic coupling between package and board!
This document introduces efforts towards a co-design platform for three-dimensional implementation module technology that stacks various devices with different manufacturing processes, such as chips, resin packages, and printed circuit boards, on a single data set, including mutual connection verification and visualization. It includes topics such as "Integrated visualization environment for power supply systems from the chip perspective," "Modeling of parasitic coupling between package and printed circuit board," and "Integrated connection verification of ultra-wide bus 3D-SiP." Please take a moment to read it. [Contents (partial)] ■ Introduction to Co-design ■ Case studies on integrated analysis of chip, package, and board ■ Integrated connection verification and analysis of ultra-wide bus 3D-SiP ■ 3D visualization and integrated verification of power circuits *For more details, please refer to the PDF document or feel free to contact us.
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【Other Published Content】 ■Case Study: Modeling Parasitic Coupling Between Package and Board ■Integrated Visualization Environment for Power Supply System from Chip Perspective ■3D/Co-Design via LPB Format Input/Output ■New Design - Co-Design Using Attribute-Free Data Summary *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Download All Catalogs![[START Analysis Example] Integrated Connections of 3D Integrated Circuits](https://image.mono.ipros.com/public/catalog/image/01/a45/598537/IPROS04512536929784332772.jpeg?w=120&h=170)
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The Heterogeneous Integration Tool is a pioneer in mixed technologies. START is a unique CAD/CAM/3D integration tool in the electronics industry. It allows for easy recognition of connections in 3D stacked circuits for LSI/PKG/Board within a seamless single database, enabling pathfinding and modeling. Due to its adoption in "ASET," it has been utilized in several national projects and research institutions. It has been adopted by "PETRA" and continues to be used by IO Core Co., Ltd. Additionally, it has been employed in quantum computer 3DIC applications (such as 3D stacking of chips). From design to manufacturing design and direct control of manufacturing equipment through custom software, it enables efficient collaboration and centralized data management via a unified database (ASCII public). By leveraging the industry's first dedicated programming language standardly included in the system, it incorporates the exceptional proprietary technologies of predecessors into the system, providing automation for data checking, modeling, drawing creation, and equipment interfaces. It supports "cost and quality" through high yield by enhancing the accuracy and speed of development progress, as well as centralized management and reuse of resources.
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