It is possible to form thick film patterns by screen printing on ceramic substrates and thin film patterns using photolithography.
As the main methods of metallization processing, we can accommodate thick film pattern formation through screen printing, and thin film pattern formation through vacuum deposition, plating, photolithography, and etching. In addition to pattern formation, we can also accommodate VIA filling, resistor formation, and through-hole formation. We will propose the optimal metallization processing to achieve the desired functions and performance. <Processing Specification Examples> - Thin Film Metallization Processing Accuracy: Line/Space = 30μm/30μm Processing Method: Vacuum deposition (sputtering or evaporation) + plating + photolithography (resist formation, exposure, development) + etching Other Processing: Through-hole formation (Φ0.1mm and above) / resistor formation - Thick Film Metallization Processing Accuracy: Line/Space = 100μm/100μm Processing Method: Screen printing Other Processing: VIA filling / resistor formation *For more details, please refer to the catalog or website, or feel free to contact us.
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basic information
<Thin Film Metallization> - Thin Film Materials Gold (Au) Copper (Cu) Titanium (Ti) Chromium (Cr) Palladium (Pd) Platinum (Pt) Tantalum Nitride (Ta₂N) etc. - Compatible Substrates Alumina and other ceramics Glass Resin films <Thick Film Metallization> - Thick Film Materials Gold (Au) Silver (Ag) Copper (Cu) Glass Solder Resist etc. - Compatible Substrates Alumina and other ceramics Glass Resin films Metals
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※Delivery times may vary depending on the quantity and type of membrane, so please feel free to contact us.
Applications/Examples of results
<Applications> Optical communication Semiconductors Measuring instruments Medical devices High voltage electrodes Sensors MEMS field Hybrid IC, etc.
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We respond to all requests with the most suitable methods, including electrode formation by metallization, ceramic sintering, polishing, lapping, pressing, and extrusion. We specialize in materials such as alumina, zirconia, macor, Shapal Hi M soft, aluminum nitride, BN, SiC, silicon nitride, quartz, tungsten, molybdenum, tantalum, and carbon, specifically for semiconductor manufacturing equipment. We cater to all needs, from short lead-time prototypes to mass production starting from one piece.