Industrial High-Power Picosecond Laser BLAZER Series
Grace Laser's BLAZER series
A high pulse repetition rate and high peak power industrial-grade DPSS picosecond laser, designed for diode excitation, ensuring long lifespan and suitability for extended use.
A compact design that is robust and hermetically sealed allows for use in various industrial material processing. ● Wavelength: 1064nm, harmonic options (532/355nm) ● Output: 10–40W@1064nm, 8–25W@532nm, 5–15W@355nm ● Maximum pulse energy: 130μJ@100kHz, 50μJ@800kHz ● Pulse repetition: 100kHz–2MHz ● Pulse width: <10–15ps@1064nm ● Excellent focusing characteristics: M2 <1.3 ● Compact and sealed robust package design ● Fully removable and closely connected structure ● Burst mode compatible ● Equipped with a process shutter Applications ■ Cutting and drilling of brittle and transparent materials ■ Micromachining ■ Thin film processing ■ Patterning
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basic information
BLAZER-P is a high-energy picosecond laser composed of a diode-pumped master oscillator and a lamp-pumped regenerative amplifier. It inherits the robust, sealed, and compact DPSS master oscillator design of the BLAZER series, and the diode-pumped regenerative amplifier and flash lamp-pumped booster amplifier can generate high-energy picosecond pulses of 200mJ. The robust industrial design for 24/7 operation enhances the reliability of the laser and reduces running costs, making it ideal for scientific applications as well. Features: ● Pulse energy: 1–200mJ @ 1064nm ● Wavelength: 1064nm with harmonic options of 532nm and 355nm ● Pulse repetition: 1Hz–10kHz ● Pulse width: <30ps ● Excellent focusing characteristics: M2 <1.5 ● Compact and robust industrial shielded package design for 24/7 operation ● Long-term temperature and mechanical stability ● RS232 interface for remote control
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Applications/Examples of results
Applications ■ Cutting and hole processing of brittle and transparent materials ■ Cutting thick glass ■ High-speed marking ■ Cutting and hole processing of materials such as PCB and FPC ■ Selecting and removing complex composite structures from different materials ■ Cutting and hole processing of brittle and transparent materials ■ Cutting silicon wafers ■ Cutting and hole processing of materials such as PCB and FPC ■ Selecting and removing complex composite structures from different materials
Company information
Our company started with the import and sales of laser oscillators and optical devices and components, and has developed through the import and sales of innovative and original electronic optical devices from around the world, as well as the provision of advanced technical services. Our main products include a variety of laser light sources ranging from semiconductor lasers to nano, pico, and femtosecond lasers, along with various devices and measurement instruments for their adjustment and control. In the field of optical spectroscopy and analysis, we provide high-performance multi-spectral fiber-coupled spectrometers and their application measurement systems (color, luminescence, absorption, Raman spectroscopy, fluorescence, plasma, LIBS, etc.), as well as thermal imaging IR lenses. Furthermore, in response to the development of thin film technology, we handle thin film measurement instruments such as thin film adhesion strength testers and optical interference film thickness monitors. Moving forward, we will enhance various applications and after-sales services to respond quickly to user demands. We will continue to firmly establish ourselves in the fields of light and nanotechnology, adapting to market trends, and aim for further development as a frontier trading company that serves everyone.
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